Semi-Automatic Lift-Off Device (Semi-Auto Lift-Off Machine) Lift-off
It is a semi-automatic lift-off device that is cheaper than an automatic machine and easier to use than a manual device.
This is a device that automatically transports, lifts off, and rinses just by setting the wafer (substrate). The lift-off process removes burrs with a high-pressure jet from the ASAP special nozzle and performs metal separation. Although it cannot be set with a cassette (carrier), unlike manual processes, it automatically transports each wafer, eliminating concerns about eccentricity or positional misalignment! With dry-in and dry-out processing, operators do not have to worry about chemical residue. The greatest advantage of lift-off is that thick metal can be blown away instantly with a high-pressure jet, making lift-off possible! Our biggest advantage is the combination of temperature-controlled stripping solution and high-pressure jet, which can also strip difficult-to-remove resist. Processes that involve brush cleaning or applying pressure for stripping can be easily replaced with high-pressure jets. [Features] - High-pressure jet lift-off up to 20 MPa - Removal of burrs during lift-off - No reattachment - Combination of temperature control and high-pressure jet - Recycling system for temperature-controlled chemicals (optional) Please feel free to try it out with a free demo!
- Company：エイ・エス・エイ・ピイ
- Price：Other
